Webster, NY, United States of America

Yuhua Tong

USPTO Granted Patents = 127 


 

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 301(Granted Patents)

Forward Citations (Not Self Cited) = 260(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Hockessin, DE (2015)
  • Webster, NY (US) (2004 - 2016)
  • Hockessin, DE (US) (2013 - 2020)

Company Filing History:


Years Active: 2004-2020

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127 patents (USPTO):Explore Patents

Title: Yuhua Tong: Innovation and Excellence in Polishing Pad Technology

Introduction:

In the world of inventions and patents, one name that stands out is Yuhua Tong. Based in Webster, NY, Yuhua Tong has made significant contributions to the field of semiconductor and substrate polishing. With an impressive portfolio of 127 patents, his expertise and innovative mindset have propelled him to the forefront of the industry. This article delves into Yuhua Tong's latest patents, career highlights, collaborations, and enduring commitment to advancing polishing pad technology.

Latest Patents:

Yuhua Tong's latest patents showcase his ingenuity and dedication to enhancing the performance and efficiency of polishing processes. One notable invention is the "Debris-removal groove for CMP polishing pad." This invention introduces a sophisticated polishing pad with radial drainage grooves that facilitate debris removal during polishing or planarizing semiconductor, optical, and magnetic substrates. By efficiently channeling debris away from the working region, Yuhua Tong's design ensures optimal polishing results, improving the quality and accuracy of polished surfaces.

Additionally, Yuhua Tong developed a novel method for making a polishing layer for a chemical mechanical polishing (CMP) pad. This technique involves utilizing an axial mixing device to combine polymeric liquid components and pressurized gas, resulting in the formation of a solidified cake. The cake is then transformed into a chemically mechanical polishing layer with a groove pattern on its surface. This remarkable method enhances the effectiveness of substrate polishing, showcasing Yuhua Tong's ability to innovate manufacturing processes for CMP pads.

Career Highlights:

Throughout his career, Yuhua Tong has held key positions in prominent companies in the industry. Notably, he has contributed his expertise to Xerox Corporation and Rohm and Haas Electronic Materials CMP Holdings, Inc. (now part of Dow Chemical Company). These esteemed companies recognize the value of his ingenuity and have provided platforms for him to bring his innovative ideas to fruition.

Collaborations:

Collaboration has played a vital role in Yuhua Tong's career, enabling him to exchange ideas and work alongside accomplished professionals. Among his notable coworkers, Jin Wu and John F Yanus have shared Yuhua Tong's passion for advancing polishing pad technology. Their collaboration has led to groundbreaking inventions, encouraging further advancements in the field.

Conclusion:

Yuhua Tong's remarkable accomplishments and extensive patent portfolio highlight his unwavering commitment to innovation in polishing pad technology. His contributions, such as the debris-removal groove for CMP polishing pads and the method for making a polishing layer, have significantly enhanced the efficiency and precision of substrate polishing processes. Yuhua Tong's valuable expertise and collaborative efforts continue to push the boundaries of the industry, inspiring future inventors and fostering continuous progress in the field of innovations and patents.

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