Yuhua Tong

This inventor holds 127 USPTO granted patents and 17 published patent applications, plus 7 CIPO patents and 16 EPO patents, primarily in Chemical Mechanical Polishing (CPC class B24B37-24). Top assignees: Xerox Corporation, Rohm and Haas Electronic Materials Cmp Holdings, Inc., Dow Global Technolgoies LLC. Active years: 2004-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuhua Tong. Retrieved from https://idiyas.com/inventor/yuhua-tong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 127 (Patent Applications = 17)

% Patents Active = 38.6

CIPO Patents = 7

EPO Patents = 16 (Patent Applications = 13)

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 302(Granted Patents)

Forward Citations (Not Self Cited) = 260(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hockessin, DE (2015)
Webster, NY (US) (2004 - 2016)
Hockessin, DE (US) (2013 - 2020)

Company Filing History:

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

patents

7 out of 4,807

Dow Global Technolgoies LLC

patents

where one patent can have more than one assignee

Years Active: 2004-2020

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Areas of Expertise:

Chemical Mechanical Polishing

Polishing Pad

Imaging Devices

Intermediate Transfer Member

Fuser Member

Polymer Composites

Toner Compositions

Flexible Members

Nanoparticle Reinforcement

Photoconductor

Charge Blocking Layer

Gelatin Release Layer

127 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10875146 - Debris-removal groove for CMP polishing pad (2020-12-29),

2. 10144115 - Method of making polishing layer for chemical mechanical polishing pad (2018-12-04),

3. 10105825 - Method of making polishing layer for chemical mechanical polishing pad (2018-10-23),

4. 10092998 - Method of making composite polishing layer for chemical mechanical polishing pad (2018-10-09),

5. 10011002 - Method of making composite polishing layer for chemical mechanical polishing pad (2018-07-03),

6. 10005172 - Controlled-porosity method for forming polishing pad (2018-06-26),

7. 9776300 - Chemical mechanical polishing pad and method of making same (2017-10-03),

8. 9586305 - Chemical mechanical polishing pad and method of making same (2017-03-07),

9. 9527224 - Endless flexible members with a polymeric release agent for imaging devices (2016-12-27),

10. 9228161 - Undercoat layer and imaging members comprising same (2016-01-05),

11. 9201353 - Intermediate transfer member and method of manufacture (2015-12-01),

12. 8940105 - Sulfonamide-doped undercoat for imaging device (2015-01-27),

13. 8929785 - Endless flexible members for imaging devices (2015-01-06),

14. 8906513 - Fuser member (2014-12-09),

15. 8824945 - Metallic nanoparticle reinforced polyimide for fuser belt with high thermal conductivity (2014-09-02),

Title: Yuhua Tong: Innovation and Excellence in Polishing Pad Technology

Introduction:

In the world of inventions and patents, one name that stands out is Yuhua Tong. Based in Webster, NY, Yuhua Tong has made significant contributions to the field of semiconductor and substrate polishing. With an impressive portfolio of 127 patents, his expertise and innovative mindset have propelled him to the forefront of the industry. This article delves into Yuhua Tong's latest patents, career highlights, collaborations, and enduring commitment to advancing polishing pad technology.

Latest Patents:

Yuhua Tong's latest patents showcase his ingenuity and dedication to enhancing the performance and efficiency of polishing processes. One notable invention is the "Debris-removal groove for CMP polishing pad." This invention introduces a sophisticated polishing pad with radial drainage grooves that facilitate debris removal during polishing or planarizing semiconductor, optical, and magnetic substrates. By efficiently channeling debris away from the working region, Yuhua Tong's design ensures optimal polishing results, improving the quality and accuracy of polished surfaces.

Additionally, Yuhua Tong developed a novel method for making a polishing layer for a chemical mechanical polishing (CMP) pad. This technique involves utilizing an axial mixing device to combine polymeric liquid components and pressurized gas, resulting in the formation of a solidified cake. The cake is then transformed into a chemically mechanical polishing layer with a groove pattern on its surface. This remarkable method enhances the effectiveness of substrate polishing, showcasing Yuhua Tong's ability to innovate manufacturing processes for CMP pads.

Career Highlights:

Throughout his career, Yuhua Tong has held key positions in prominent companies in the industry. Notably, he has contributed his expertise to Xerox Corporation and Rohm and Haas Electronic Materials CMP Holdings, Inc. (now part of Dow Chemical Company). These esteemed companies recognize the value of his ingenuity and have provided platforms for him to bring his innovative ideas to fruition.

Collaborations:

Collaboration has played a vital role in Yuhua Tong's career, enabling him to exchange ideas and work alongside accomplished professionals. Among his notable coworkers, Jin Wu and John F Yanus have shared Yuhua Tong's passion for advancing polishing pad technology. Their collaboration has led to groundbreaking inventions, encouraging further advancements in the field.

Conclusion:

Yuhua Tong's remarkable accomplishments and extensive patent portfolio highlight his unwavering commitment to innovation in polishing pad technology. His contributions, such as the debris-removal groove for CMP polishing pads and the method for making a polishing layer, have significantly enhanced the efficiency and precision of substrate polishing processes. Yuhua Tong's valuable expertise and collaborative efforts continue to push the boundaries of the industry, inspiring future inventors and fostering continuous progress in the field of innovations and patents.

Profile summary based on public USPTO records.