Xerox Corporation

Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Dow Global Technolgoies LLC

Timothy J. Fuller

Dale S. Renfer

Markus R. Silverstri

Yuhua Tong

John F. Yanus

Kenny-tuan T. Dinh

Jin Wu

John F Yanus

Edward F Grabowski

Robert C U Yu

Markus Rudolf Silvestri

Timothy J Fuller

Kathleen M Carmichael

Dale S Renfer

Chieh-Min Cheng

Satchidanand Mishra

Kenny-Tuan Dinh

Nancy Lynn Belknap

Anthony M Horgan

Michael Stephen Roetker

Helen R Cherniack

Kent J Evans

Jonathan H Herko

Liang-Bih Lin

Cindy C Chen

Zhen Lai

Min-Hong Fu

Susan M VanDusen

Damodar M Pai

Lanhui Zhang

Richard L Post

Kyle B Tallman

George C Jacob

Stephen T Avery

Francisco Jose Lopez

Timothy L Lincoln

Dennis J Prosser

Dante M Pietrantoni

Andrew Wank

Jeffrey Borcherdt Miller

Huoy-Jen Yuh

Linda L Ferrarese

Bainian Qian

David W Martin

Julia Kozhukh

Teresa Brugarolas Brufau

Robert P Altavela

Marty W DeGroot

Jennifer Y Hwang

Nan-Xing Hu

Yu Qi

Robert D Bayley

Paul J DeFeo

John J Wilbert

Fengji Yeh

Anita P Lynch

Tony Quan Tran

Kock-Yee Law

Geoffrey M T Foley

Marc J Livecchi

Brian P Gilmartin

David M Skinner

Jeffrey James Hendron

Christopher M Wolfe

Jimmy E Kelly

John Graham

T Edwin Freeman

Joo T Chung

Scott J Griffin

Merlin E Scharfe

Peter Van Nguyen

Alexander N Klymachyov

Edward C Savage

Robert J Meyer

Joseph L Leonardo

John A Bergfjord, Sr

Michael E Zak

Beng S Ong

Pinyen Lin

Grazyna E Kmiecik-Lawrynowicz

William W Limburg

James McConnell Duff

Mandakini Kanungo

Paul Farrell Smith

Shigang S Qiu

John S Chambers

Paul Joseph Gerroir

Lee Melbourne Cook

H Bruce Goodbrand

Heiko Rommelmann

Santiago Faucher

Maura A Sweeney

Allan K Chen

Samir Kumar

John L Pawlak

Fumii Higuchi

William H Hollenbaugh, Jr

Mark E Mang

Joseph K So

Steven M Malachowski

Andronique Ioannidis

Edward A Domm

Louis V Isganitis

Kevin F Marcell

Donald J Goodman

The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.

Debris-removal groove for CMP polishing pad

A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 5 to 1,000 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.

Method of making polishing layer for chemical mechanical polishing pad

A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.

A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 5 to 1,000 m/sec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.

Method of making composite polishing layer for chemical mechanical polishing pad

A method of forming a chemical mechanical polishing pad composite polishing layer is provided, including: providing a first polishing layer component of a first continuous non-fugitive polymeric phase having a plurality of periodic recesses; discharging a combination toward the first polishing layer component at a velocity of 10 to 300 msec, filling the plurality of periodic recesses with the combination; allowing the combination to solidify in the plurality of periodic recesses forming a second non-fugitive polymeric phase giving a composite structure; and, deriving the chemical mechanical polishing pad composite polishing layer from the composite structure, wherein the chemical mechanical polishing pad composite polishing layer has a polishing surface on the polishing side of the first polishing layer component; and wherein the polishing surface is adapted for polishing a substrate.

The invention is to a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method includes applying droplets of a liquid polymer against a substrate to form a plurality of pores. The liquid polymer contains a nonionic surfactant, the nonionic surfactant has a concentration sufficient to facilitate growth of pores within the liquid polymer and an ionic surfactant has a concentration sufficient to limit growth of the pores within the liquid polymer. Curing the solid polymer forms a polishing pad with final size of the plurality of pores controlled by the concentration of nonionic surfactant and ionic surfactants.

Controlled-porosity method for forming polishing pad

A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of &#x2267;10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of &#x3c;40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.

Chemical mechanical polishing pad and method of making same

Flexible members for use in imaging devices comprise a polymerizable release agent.

Endless flexible members with a polymeric release agent for imaging devices

Disclosed are undercoat layers comprising a metal oxide, a polymer, and a citrate of Formula (I): wherein Ris H, alkyl, or COR'; wherein R&#x2032; is alkyl; and wherein R, R, and Rare independently alkyl. The undercoat layers are useful in imaging members because they are easily separated from the substrate. This reduces the number of steps necessary to reclaim the substrate.

Undercoat layer and imaging members comprising same

According to various embodiments, the present teachings provide an intermediate transfer member including a layer having a phosphorous containing polyamideimide having dispersed therein a conductive additive. A method of manufacturing the intermediate transfer member is provided.

Intermediate transfer member and method of manufacture

A photoreceptor undercoat containing a sulfonamide facilitates removal of coatings from the substrate.

Sulfonamide-doped undercoat for imaging device

Flexible members for use in imaging devices contain a non-ionic surfactant and a fluorinated surfactant.

Endless flexible members for imaging devices

The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyamideimide/polybenzimidazole polymer blend. A method of manufacturing the fuser member is described.

Fuser member

A fuser belt for an electrostatographic device and methods for making the fuser belt can include the use of a polyimide and a plurality of copper nanoparticles. The use of copper nanoparticles can result in a fuser belt having a lower heat capacity and a higher thermal conductivity than conventional fuser belts.

Metallic nanoparticle reinforced polyimide for fuser belt with high thermal conductivity

Growing community of inventors

Webster, NY, United States of America

Yuhua Tong