The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2020
Filed:
Mar. 24, 2016
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Lee Melbourne Cook, Atglen, PA (US);
Yuhua Tong, Hockessin, DE (US);
Joseph So, Wilmington, DE (US);
Jeffrey James Hendron, Elkton, MD (US);
Patricia Connell, Rising Sun, MD (US);
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Newark, DE (US);
Abstract
The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial drainage grooves extend through the polishing track facilitate polishing debris removal through the polishing track and underneath the at least one of semiconductor, optical and magnetic substrates and then beyond the polishing track toward the perimeter of the polishing pad during rotation of the polishing pad.