The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2017
Filed:
Jun. 26, 2015
Rohm and Haas Electronic Materials Cmp Holdings, Inc., Newark, DE (US);
Dow Global Technologies Llc, Midland, MI (US);
Bainian Qian, Newark, DE (US);
Julia Kozhukh, Bear, DE (US);
Teresa Brugarolas Brufau, Philadelphia, PA (US);
Diego Lugo, Newark, DE (US);
George C. Jacob, Newark, DE (US);
Jeffrey B. Miller, West Chester, PA (US);
Tony Quan Tran, Bear, DE (US);
Marc R. Stack, Middletown, DE (US);
Jeffrey James Hendron, Elkton, MD (US);
Rohm and Haas Electronic Materials CMP Holdings, Inc., Newark, DE (US);
Dow Global Technologies LLC, Midland, MI (US);
Abstract
A chemical mechanical polishing pad is provided containing: a polishing layer having a polishing surface; wherein the polishing layer comprises a first continuous non-fugitive polymeric phase and a second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has a plurality of periodic recesses; wherein the plurality of periodic recesses are occupied with the second non-fugitive polymeric phase; wherein the first continuous non-fugitive polymeric phase has an open cell porosity of ≦6 vol %; wherein the second non-fugitive polymeric phase contains an open cell porosity of ≧10 vol %; and, wherein the polishing surface is adapted for polishing a substrate.