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For the Inventor, By the Inventor

King of Prussia, PA, United States of America

Zhendong Liu

This inventor holds 21 USPTO granted patents and 2 published patent applications and 4 EPO patents, primarily in Chemical Mechanical Polishing. Top assignee: Rohm and Haas Electronic Materials Cmp Holdings, Inc.. Active years: 2005-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhendong Liu. Retrieved from https://idiyas.com/inventor/zhendong-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 21 

% Patents Active = 66.7

 

Average Co-Inventor Count = 2.2

ph-index = 6

Forward Citations = 110(Granted Patents)


Location History:

  • Newark, DE (US) (2005 - 2011)
  • King of Prussia, PA (US) (2011 - 2014)

Company Filing History:

goldMedal21 out of 312 
 
Rohm and Haas Electronic Materials Cmp Holdings, Inc.
 patents

Years Active: 2005-2014

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Areas of Expertise:
Chemical Mechanical Polishing
Polishing Composition
Semiconductor Layers
Barrier Polishing
Dielectric Polishing
Polishing Method
Polysilicon
Silicon Oxide
Silicon Nitride
Corrosion-Resistant
Multi-Component Solution
High-Rate Composition
21 patents (USPTO):Explore Patents
1. 8735293 - Chemical mechanical polishing composition and methods relating thereto (2014-05-27),
2. 8568610 - Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate (2013-10-29),
3. 8513126 - Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate (2013-08-20),
4. 8496843 - Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride (2013-07-30),
5. 8492277 - Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride (2013-07-23),
6. 8491808 - Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride (2013-07-23),
7. 8444728 - Stabilized chemical mechanical polishing composition and method of polishing a substrate (2013-05-21),
8. 8431490 - Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal (2013-04-30),
9. 8232208 - Stabilized chemical mechanical polishing composition and method of polishing a substrate (2012-07-31),
10. 8119529 - Method for chemical mechanical polishing a substrate (2012-02-21),
11. 8071479 - Chemical mechanical polishing composition and methods relating thereto (2011-12-06),
12. 8025813 - Chemical mechanical polishing composition and methods relating thereto (2011-09-27),
13. 7981316 - Selective barrier metal polishing method (2011-07-19),
14. 7842192 - Multi-component barrier polishing solution (2010-11-30),
15. 7427362 - Corrosion-resistant barrier polishing solution (2008-09-23),

Title: Zhendong Liu: Innovator in Chemical Mechanical Polishing Technologies

Introduction: Zhendong Liu is an accomplished inventor based in King of Prussia, Pennsylvania. With an impressive portfolio of 21 patents, Liu has made significant contributions to the field of chemical mechanical polishing (CMP) and continues to drive innovation through his work.

Latest Patents: Among Liu's latest patents are innovative methods and compositions for chemical mechanical polishing. His first notable patent describes a method for polishing substrates that incorporate a germanium-antimony-tellurium chalcogenide phase change alloy. This composition features water, colloidal silica abrasive particles, and is free from oxidizers and chelating agents, with a pH range of 6 to 12, enhancing the effectiveness of the polishing process.

Another important patent involves a stabilized and concentratable CMP composition, which includes water, an abrasive, and specific substances that ensure optimal performance in polishing substrates, particularly those containing silicon dioxide. This method emphasizes dynamic contact at the polishing interface and features a pH range of 2 to 6, showcasing Liu's commitment to improving CMP techniques.

Career Highlights: Currently, Zhendong Liu is employed at Rohm and Haas Electronic Materials CMP Holdings, Inc., where he leverages his expertise to advance CMP technologies. His innovative spirit and technical knowledge have positioned him as a valuable asset to the company and the industry as a whole.

Collaborations: Throughout his career, Liu has collaborated with notable colleagues, including Yi Guo and Kancharla-Arun Kumar Reddy. These partnerships have fostered an environment of creativity and have propelled the development of cutting-edge polishing solutions.

Conclusion: Zhendong Liu's dedication to innovation and his substantial contributions to chemical mechanical polishing technologies underscore his importance in the field. With 21 patents to his name, Liu continues to push the boundaries of what's possible, showcasing the profound impact of his work and inspiring future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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