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For the Inventor, By the Inventor

Bear, DE, United States of America

Kancharla-Arun Kumar Reddy

USPTO Granted Patents = 19 

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 28(Granted Patents)


Location History:

  • Bear, DE (2013)
  • Bear, DE (US) (2011 - 2014)
  • Wilmington, DE (US) (2019 - 2023)

Company Filing History:

goldMedal19 out of 308 
 
Rohm and Haas Electronic Materials Cmp Holdings, Inc.
 patents
silverMedal1 out of 70 
 
Dupont Electronics, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2011-2025

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19 patents (USPTO):Explore Patents
1. 12220784 - Chemical mechanical polishing pad and preparation thereof (2025-02-11),
2. 11679531 - Chemical mechanical polishing pad and preparation thereof (2023-06-20),
3. 11524390 - Methods of making chemical mechanical polishing layers having improved uniformity (2022-12-13),
4. 10464187 - High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives (2019-11-05),
5. 10316218 - Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them (2019-06-11),
6. 10221336 - Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them (2019-03-05),
7. 8790160 - Chemical mechanical polishing composition and method for polishing phase change alloys (2014-07-29),
8. 8568610 - Stabilized, concentratable chemical mechanical polishing composition and method of polishing a substrate (2013-10-29),
9. 8513126 - Slurry composition having tunable dielectric polishing selectivity and method of polishing a substrate (2013-08-20),
10. 8496843 - Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride (2013-07-30),
11. 8492277 - Method of polishing a substrate comprising polysilicon and at least one of silicon oxide and silicon nitride (2013-07-23),
12. 8491808 - Method of polishing a substrate comprising polysilicon, silicon oxide and silicon nitride (2013-07-23),
13. 8444728 - Stabilized chemical mechanical polishing composition and method of polishing a substrate (2013-05-21),
14. 8440094 - Method of polishing a substrate (2013-05-14),
15. 8435420 - Method of polishing using tunable polishing formulation (2013-05-07),

Title: Kancharla-Arun Kumar Reddy: A Pioneer in Chemical Mechanical Polishing Innovation

Introduction

Kancharla-Arun Kumar Reddy, based in Bear, DE, has made significant contributions to the field of chemical mechanical polishing with a noteworthy portfolio of 19 patents. His innovative approaches have propelled advancements in material sciences, particularly in the electronics sector.

Latest Patents

Among his recent inventions, Reddy has developed a chemical mechanical polishing pad featuring a unique polishing layer. This layer consists of an extruded sheet made from a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator. Furthermore, he has made strides in enhancing the preparation methods for these polishing pads, utilizing a process that involves extruding a compounded photopolymerizable composition followed by exposure to UV light.

Career Highlights

Reddy's career includes significant tenures at leading companies in the electronic materials industry. He has worked at Rohm and Haas Electronic Materials CMP Holdings, Inc. and DuPont Electronics, Inc., where he honed his expertise and contributed to various innovative projects.

Collaborations

Throughout his career, Reddy collaborated with notable colleagues such as Yi Guo and Guangyun Zhang, sharing insights and fostering innovation in their respective fields.

Conclusion

Kancharla-Arun Kumar Reddy stands out as a key innovator in the field of chemical mechanical polishing. His extensive patent portfolio and collaborative efforts highlight his dedication to advancing material technologies, setting a precedent for future research and development in the electronic materials industry.

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