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Nippon Mining & Metals Co., Ltd.

USPTO Granted Patents = 165

CIPO Patents = 5

EPO Patents = 50

Trademarks = 4

Forward Citations = 660

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167 inventors (with patents filed for the assignee):

Toru Imori (18 out of 38 patents)

Masataka Yahagi (13 out of 31 patents)

Junnosuke Sekiguchi (13 out of 22 patents)

4. Toshiyuki Ono (10 out of 60 patents)

5. Ryuichi Hirano (8 out of 27 patents)

6. Takeo Okabe (8 out of 29 patents)

7. Atsushi Yabe (8 out of 10 patents)

8. Toshiaki Asahi (8 out of 12 patents)

9. Kenji Sato (8 out of 15 patents)

10. Ryo Suzuki (7 out of 33 patents)

11. Yuichiro Shindo (7 out of 41 patents)

12. Akihiro Aiba (7 out of 13 patents)

13. Atsutoshi Arakawa (7 out of 9 patents)

14. Norio Yuki (7 out of 9 patents)

15. Hideo Takami (6 out of 24 patents)

Core Competencies:

InP Single Crystal Wafer

Flexible Substrate

Electroless Copper Plating

Epitaxial Growth Process

Copper Electrolytic Solution

Lithium Secondary Battery

Sputtering Target

Metal Plating Method

Gallium Oxide-Zinc Oxide

Hydrogen Separation Membrane

Iron Silicide Powder

Zinc Oxide-Based Transparent Conductor

165 patents: Sort by Forward Citations

1. 8815010 - InP single crystal wafer and method for producing InP single crystal (2014-08-26),

2. 8736057 - Substrate and manufacturing method therefor (2014-05-27),

3. 8585798 - Method for recovering metal from ore (2013-11-19),

4. 8568856 - Two-layer flexible substrate (2013-10-29),

5. 8476171 - Heat treatment method of ZnTe single crystal substrate and ZnTe single crystal substrate (2013-07-02),

6. 8449751 - Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same (2013-05-28),

7. 8404035 - Electroless copper plating solution (2013-03-26),

8. 8394508 - Plated article having metal thin film formed by electroless plating (2013-03-12),

9. 8390123 - ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer (2013-03-05),

10. 8247301 - Substrate and manufacturing method therefor (2012-08-21),

11. 8231728 - Epitaxial growth process (2012-07-31),

12. 8182873 - Method for electroless plating and metal-plated article (2012-05-22),

13. 8182594 - Electroless nickel plating liquid (2012-05-22),

14. 8163400 - Plated article having metal thin film formed by electroless plating, and manufacturing method thereof (2012-04-24),

15. 8137460 - Manufacturing method of GaN thin film template substrate, GaN thin film template substrate and GaN thick film single crystal (2012-03-20),

Nippon Mining & Metals Co., Ltd. is a Japanese company engaged in the metal and mining industry. With its headquarters in Tokyo, the company focuses on the exploration, production, and refining of metals such as copper, zinc, gold, and silver. With a history spanning decades, Nippon Mining & Metals has established itself as a leading player in the global metals market, delivering high-quality products and contributing to various industries worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

165 Patents

#354 in Tokyo

#783 in Japan

#4,875 in the World

Nippon Mining & Metals Co., Ltd.

Forward Citations = 660

167 inventors:

Toru Imori (18 out of 38 patents)

Masataka Yahagi (13 out of 31 patents)

Junnosuke Sekiguchi (13 out of 22 patents)

4. Toshiyuki Ono (10 out of 60 patents)

5. Ryuichi Hirano (8 out of 27 patents)

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