The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8182594 B1

PDF
Full Text
Expired
Date of Patent:
May. 22, 2012

Filed:

Sep. 26, 2006
Applicants:

Eiji Hino, Kitaibaraki, JP;

Masashi Kumagai, Kitaibaraki, JP;

Inventors:

Eiji Hino, Kitaibaraki, JP;

Masashi Kumagai, Kitaibaraki, JP;

Assignee:

Nippon Mining & Metals Co., Ltd., Minato-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electroless nickel plating liquid capable of forming an underbarrier metal for metal bumps or solder bumps by electroless nickel plating with a uniform film thickness on silicon wafers composed of multiple IC chips contains a water-soluble nickel salt, a reducing agent, a complexing agent, and a pH buffer, wherein_lead ion is contained at 0.01-1 ppm, cobalt ion is contained at 0.01-1 ppm, and a sulfur compound is contained at 0.01-1 ppm.


Find Patent Forward Citations

Hino, Eiji. (2012). Electroless nickel plating liquid (U.S. Patent No. 8182594). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8182594

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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