Hitachi, Japan

Masashi Kumagai

This inventor holds 21 USPTO granted patents and 2 EPO patents, primarily in Copper Electrolytic Solutions. Top assignees: Nikko Materials Company, Limited, Nippon Mining & Metals Co., Ltd.. Active years: 2003-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masashi Kumagai. Retrieved from https://idiyas.com/inventor/masashi-kumagai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 95.2


Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 89(Granted Patents)


Location History:

  • Hitachi, JP (2003 - 2013)
  • Kitaibaraki, JP (2004 - 2013)

Company Filing History:


Years Active: 2003-2013

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Areas of Expertise:
Copper Electrolytic Solution
Flexible Substrate
Electroless Nickel Plating
Surface Treatment
Silane Coupling Agent
Organic Carboxylic Acid
Metal Plating Method
Water-Based Treatment
Epoxy Resin Composition
Copper Foil
Additives
Organic Sulfur Compound
21 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Masashi Kumagai

Introduction: Masashi Kumagai is a prominent inventor hailing from Hitachi, Japan. With an impressive portfolio of 21 patents, his work primarily focuses on advancements in flexible substrates and electrolytic copper foils. His innovations are significant in the electronics and materials science industries.

Latest Patents: Among Kumagai's latest patents, two notable contributions stand out. The first is a "Two-layer flexible substrate," which provides a robust solution free of surface defects with excellent etching characteristics. This invention features a copper layer applied directly to an insulator film, avoiding the need for adhesives. The precise specifications include a surface roughness (Ra) ranging from 0.10 to 0.25 µm and an average crystal grain size of no more than 0.8 µm within 1 µm from the insulator film.

The second patent involves a novel method for producing electrolytic copper foil. This invention aims to create a low-profile foil with finely patterned attributes and excellent elongation and tensile strength, both at normal and elevated temperatures. The process utilizes a unique copper electrolytic solution that incorporates specific organosulfur and amine compounds to optimize performance.

Career Highlights: Masashi Kumagai has amassed substantial experience while working for notable companies, including Nikko Materials Company and Nippon Mining & Metals Co., Ltd. His career reflects a commitment to innovation and technological advancement in the materials sector.

Collaborations: Throughout his career, Kumagai has collaborated with talented individuals, including Katsuyuki Tsuchida and Mikio Hanafusa. These partnerships have contributed to the successful development of his patented technologies and furthered research in his field.

Conclusion: Masashi Kumagai's contributions through his 21 patents have significantly impacted the fields of flexible substrates and copper foil production. His innovative approaches and collaborations underscore the importance of creativity and technical expertise in driving advancements in material sciences. As his work continues to evolve, it promises to inspire future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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