The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Aug. 22, 2006
Katsuyuki Tsuchida, Kitaibaraki, JP;
Hironori Kobayashi, Kitaibaraki, JP;
Ryu Murakami, Kitaibaraki, JP;
Masashi Kumagai, Kitaibaraki, JP;
Katsuyuki Tsuchida, Kitaibaraki, JP;
Hironori Kobayashi, Kitaibaraki, JP;
Ryu Murakami, Kitaibaraki, JP;
Masashi Kumagai, Kitaibaraki, JP;
Nippon Mining & Metals Co., Ltd., Tokyo, JP;
Abstract
The invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist. The two-layer flexible substrate has a copper layer provided on one or both faces of an insulator film without using an adhesive, wherein the surface roughness (Ra) of the copper layer is 0.10 to 0.25 μm, and wherein the average crystal grain size [of copper] is no greater than 0.8 μm at 1 μm from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film.