Ryu Murakami

Title: Ryu Murakami: Innovator in Flexible Substrate Technology

Introduction

Ryu Murakami is a notable inventor hailing from Kitaibaraki, Japan. He has made significant contributions to the field of flexible substrate technology, particularly through his innovative patent that addresses surface defects and etching characteristics.

Latest Patents

Ryu Murakami holds a patent for a two-layer flexible substrate. This invention provides a two-layer flexible substrate free of surface defects and having excellent etching characteristics and adherence to a resist. The two-layer flexible substrate features a copper layer provided on one or both faces of an insulator film without using an adhesive. The surface roughness (Ra) of the copper layer is maintained between 0.10 to 0.25 µm, and the average crystal grain size of copper does not exceed 0.8 µm at 1 µm from the insulator film in the cross-section of the copper layer. Preferably, the insulator film is a polyimide film. This innovation is crucial for enhancing the performance and reliability of flexible electronic devices.

Career Highlights

Ryu Murakami is associated with Nippon Mining & Metals Co., Ltd., where he has been instrumental in advancing research and development in materials science. His work has not only contributed to the company's portfolio but has also positioned him as a key figure in the industry.

Collaborations

Throughout his career, Ryu has collaborated with talented individuals such as Katsuyuki Tsuchida and Hironori Kobayashi. These collaborations have fostered a creative environment that has led to groundbreaking advancements in flexible substrate technology.

Conclusion

Ryu Murakami's contributions to the field of flexible substrates exemplify the spirit of innovation. His patent for a two-layer flexible substrate showcases his commitment to enhancing technology in the electronics industry. His work continues to inspire future advancements in material science.