Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same

Abstract

The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton represented by undermentioned general formula (1) obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction. (In general formula (1), R1 and R2 are each selected from a group consisting of hydroxyalkyl groups, ether groups, aromatic groups, aromatic-substituted alkyl groups, unsaturated hydrocarbon groups, and alkyl groups, A represents an epoxy compound residue, and n represents an integer greater than or equal to 1.)