Location History:
- Ibaraki, JP (2003 - 2013)
- Hitachi, JP (2006 - 2013)
Company Filing History:
6 out of 58 
3 out of 165 
1 out of 481 
Years Active: 2003-2013
Title: Mikio Hanafusa: Innovator in Copper-Clad Laminate Technology
Introduction
Mikio Hanafusa is a prominent inventor based in Hitachi, Japan, known for his significant contributions to the field of materials science, particularly in the development of copper-clad laminates. With a total of 10 patents to his name, Hanafusa has made strides in enhancing the performance and durability of electronic components.
Latest Patents
Hanafusa's latest patents include a method of producing a two-layered copper-clad laminate and the laminate itself. This innovative method improves folding endurance, allowing the laminate to withstand 150 folds or more, as measured by a specific test. The process involves forming a copper layer on a polyimide film through sputtering and plate processing, followed by heat treatment at controlled temperatures. Another notable patent focuses on a copper electrolytic solution that incorporates specific additives to produce a low-profile electrolytic copper foil. This foil is designed for fine patterning and exhibits excellent elongation and tensile strength at various temperatures.
Career Highlights
Throughout his career, Hanafusa has worked with notable companies such as Nikko Materials Company, Limited and Nippon Mining & Metals Co., Ltd. His work has significantly impacted the manufacturing processes and quality of electronic materials, making him a respected figure in the industry.
Collaborations
Hanafusa has collaborated with esteemed colleagues, including Masashi Kumagai and Kouji Kitano, contributing to advancements in their respective fields.
Conclusion
Mikio Hanafusa's innovative work in copper-clad laminate technology showcases his dedication to improving electronic materials. His patents reflect a commitment to enhancing product performance and reliability in the electronics industry.