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Nikko Materials Company, Limited

USPTO Granted Patents = 58

EPO Patents = 2

Trademarks = 1

Forward Citations = 429

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70 inventors (with patents filed for the assignee):

Masashi Kumagai (16 out of 21 patents)

Katsuyuki Tsuchida (9 out of 13 patents)

Kazutoshi Iwata (6 out of 7 patents)

4. Hirohito Miyashita (6 out of 20 patents)

5. Mikio Hanafusa (6 out of 10 patents)

6. Yoshiaki Honma (5 out of 10 patents)

7. Takashi Ouchi (5 out of 5 patents)

8. Takeshi Yamaguchi (4 out of 135 patents)

9. Toru Imori (4 out of 38 patents)

10. Taihei Matsumoto (3 out of 3 patents)

11. Takeo Okabe (3 out of 29 patents)

12. Yuichiro Shindo (3 out of 41 patents)

13. Fumiaki Akase (3 out of 3 patents)

14. Kenji Sato (3 out of 15 patents)

15. Kunihiro Oda (2 out of 24 patents)

Core Competencies:

Laminating Apparatus

Copper Electrolytic Solution

Electroless Gold Plating

II-VI Compound Semiconductor

Sputtering Target

Surface Treatment Agent

High-Purity Metal Production

Organic Carboxylic Acid Salt

Copper Clad Laminate

Hafnium Silicide Target

Lithium-Containing Complex Oxide

GaN Based Compound Semiconductor

58 patents: Sort by Forward Citations

1. 11485124 - Laminating apparatus and laminating method using same (2022-11-01),

2. 11446913 - Laminating apparatus (2022-09-20),

3. 11331892 - Laminating apparatus (2022-05-17),

4. 11325365 - Laminating apparatus (2022-05-10),

5. 10239299 - Laminating apparatus (2019-03-26),

6. 10081170 - Laminating apparatus (2018-09-25),

7. 7777078 - Copper electrolytic solution and electrolytic copper foil produced therewith (2010-08-17),

8. 7678257 - Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same (2010-03-16),

9. 7651783 - Surface treated copper film (2010-01-26),

10. 7432335 - Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same (2008-10-07),

11. 7419536 - Electroless gold plating liquid (2008-09-02),

12. 7390354 - Electroless gold plating solution (2008-06-24),

13. 7378160 - Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same (2008-05-27),

14. 7300501 - Electroless gold plating liquid (2007-11-27),

15. 7288242 - Lithium-containing complex oxide and method of producing same (2007-10-30),

Nikko Materials Company, Limited is a global leader in providing high-quality metal materials and components for various industries. With a rich history spanning over 50 years, the company is known for its advanced technology, innovation, and commitment to customer satisfaction. Nikko Materials offers a wide range of products including alloys, sheets, plates, and rods, with applications in automotive, electronics, aerospace, and other sectors. They strive to continuously improve their processes, develop new materials, and deliver reliable solutions to meet the evolving needs of their clients.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

58 Patents

#652 in Tokyo

#1,543 in Japan

#12,101 in the World

Nikko Materials Company, Limited

Forward Citations = 429

70 inventors:

Masashi Kumagai (16 out of 21 patents)

Katsuyuki Tsuchida (9 out of 13 patents)

Kazutoshi Iwata (6 out of 7 patents)

4. Hirohito Miyashita (6 out of 20 patents)

5. Mikio Hanafusa (6 out of 10 patents)

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