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Nikko Materials Company, Limited

USPTO Granted Patents = 58

% Expired Patents = 6.9

EPO Patents = 2

Trademarks = 1

Forward Citations = 430

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70 inventors (with patents filed for the assignee):

Masashi Kumagai (16 out of 21 patents)

Katsuyuki Tsuchida (9 out of 13 patents)

Kazutoshi Iwata (6 out of 7 patents)

4. Hirohito Miyashita (6 out of 20 patents)

5. Mikio Hanafusa (6 out of 10 patents)

6. Yoshiaki Honma (5 out of 11 patents)

7. Takashi Ouchi (5 out of 5 patents)

8. Takeshi Yamaguchi (4 out of 137 patents)

9. Toru Imori (4 out of 38 patents)

10. Taihei Matsumoto (3 out of 4 patents)

11. Takeo Okabe (3 out of 30 patents)

12. Yuichiro Shindo (3 out of 41 patents)

13. Fumiaki Akase (3 out of 3 patents)

14. Kenji Sato (3 out of 15 patents)

15. Kunihiro Oda (2 out of 24 patents)

Core Competencies:

Copper Electrolytic Solution

Electroless Plating

Semiconductor Wafer

Lithium Secondary Battery

Sputtering Target

Silane Coupling Agent

Copper Foil

Optical Transparent Film

Metal Surface Treatment

Compound Semiconductor

High Purity Metal

Epoxy Resin

58 patents: Sort by Forward Citations

1. 11485124 - Laminating apparatus and laminating method using same (2022-11-01),

2. 11446913 - Laminating apparatus (2022-09-20),

3. 11331892 - Laminating apparatus (2022-05-17),

4. 11325365 - Laminating apparatus (2022-05-10),

5. 10239299 - Laminating apparatus (2019-03-26),

6. 10081170 - Laminating apparatus (2018-09-25),

7. 7777078 - Copper electrolytic solution and electrolytic copper foil produced therewith (2010-08-17),

8. 7678257 - Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same (2010-03-16),

9. 7651783 - Surface treated copper film (2010-01-26),

10. 7432335 - Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same (2008-10-07),

11. 7419536 - Electroless gold plating liquid (2008-09-02),

12. 7390354 - Electroless gold plating solution (2008-06-24),

13. 7378160 - Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same (2008-05-27),

14. 7300501 - Electroless gold plating liquid (2007-11-27),

15. 7288242 - Lithium-containing complex oxide and method of producing same (2007-10-30),

Company Overview

Nikko Materials Company, Limited, based in Tokyo, specializes in advanced materials and solutions primarily for the electronics and semiconductor industries. The company focuses on the development and manufacturing of copper electrolytic solutions, which are essential for various applications including electroless plating and semiconductor wafers. Additionally, Nikko Materials is involved in producing materials for lithium secondary batteries, sputtering targets, and optical transparent films, contributing significantly to technological advancements in these fields.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

58 Patents

#743 in Tokyo

#1,572 in Japan

#12,395 in the World

Nikko Materials Company, Limited

Forward Citations = 430

70 inventors:

Masashi Kumagai (16 out of 21 patents)

Katsuyuki Tsuchida (9 out of 13 patents)

Kazutoshi Iwata (6 out of 7 patents)

4. Hirohito Miyashita (6 out of 20 patents)

5. Mikio Hanafusa (6 out of 10 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nikko Materials Company, Limited. Retrieved from https://idiyas.com/company/nikko-materials-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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