The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2003
Filed:
Jul. 11, 2002
Applicant:
Inventors:
Kouji Kitano, Ibaraki, JP;
Mikio Hanafusa, Ibaraki, JP;
Assignee:
Nikko Materials Company, Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 2/600 ; B23K 2/638 ; B32B 3/10 ; B32B 1/520 ; C25D 5/48 ;
U.S. Cl.
CPC ...
B23K 2/600 ; B23K 2/638 ; B32B 3/10 ; B32B 1/520 ; C25D 5/48 ;
Abstract
A copper foil with excellent laser drilling property, having a layer containing any one or more substances selected from indium, tin, cobalt, zinc, cobalt alloys, and nickel alloys on the face of the copper foil to be radiated with laser beams. A copper foil easy to be laser-processed and suitable for forming through hole and via hole with a small diameter at the time of manufacturing a printed circuit board and a method for manufacturing such a copper foil are achieved by improving the surface of a copper foil.