Company Filing History:
Years Active: 2003-2004
Title: Kouji Kitano: Innovator in Copper Clad Laminate Technology
Introduction
Kouji Kitano is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of printed circuit board technology, particularly through his innovative patents related to copper clad laminates. With a total of 2 patents, Kitano's work has advanced the manufacturing processes in this critical area of electronics.
Latest Patents
Kitano's latest patents focus on enhancing the efficiency of laser beam drilling in copper clad laminates. One of his patents describes a copper clad laminate that simplifies laser beam drilling, making it suitable for forming interlayer connection microholes. This laminate features electrodeposited copper foil, with the matte side serving as the entry point for the laser beam, thereby improving the production of printed circuit boards. Another patent introduces a copper foil with superior laser drilling properties. This foil includes a layer of substances such as indium, tin, cobalt, zinc, and nickel alloys, which enhances its suitability for creating small-diameter through holes and via holes during the manufacturing process.
Career Highlights
Kouji Kitano is associated with Nikko Materials Company, Limited, where he applies his expertise in materials science to develop innovative solutions for the electronics industry. His work has been instrumental in improving the performance and manufacturability of printed circuit boards.
Collaborations
Throughout his career, Kitano has collaborated with esteemed colleagues, including Mikio Hanafusa and Masaru Sakamoto. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Kouji Kitano's contributions to copper clad laminate technology have significantly impacted the electronics manufacturing industry. His innovative patents demonstrate his commitment to advancing technology and improving production processes.