The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2004
Filed:
Aug. 14, 2002
Applicant:
Inventors:
Masaru Sakamoto, Ibaraki, JP;
Kouji Kitano, Ibaraki, JP;
Assignee:
Nikko Materials Company, Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/508 ; B32B 3/24 ; H05K 1/09 ; B23K 2/600 ; B23K 2/618 ;
U.S. Cl.
CPC ...
B32B 1/508 ; B32B 3/24 ; H05K 1/09 ; B23K 2/600 ; B23K 2/618 ;
Abstract
There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the production of printed circuit boards. Specifically, the copper clad laminate is such that it includes electrodeposited copper foil for use in the laser beam drilling and is characterized in that the matte side of the above electrodeposited copper foil is used as the surface which the laser beam enters.