The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Nov. 26, 2008
Junichi Ito, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Junichi Ito, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Nippon Mining & Metals Co., Ltd., Tokyo, JP;
Abstract
A substrate having, on a base material, a barrier film for preventing copper diffusion containing one or more metal elements selected from tungsten, molybdenum and niobium, a metal element having a catalytic function in electroless plating such as platinum, gold, silver and palladium, and nitrogen contained in the form of a nitride of the aforementioned one or more metal elements selected from tungsten, molybdenum and niobium. The barrier film for preventing copper diffusion is manufactured by sputtering in a nitrogen atmosphere using a target containing one or more metal elements selected from tungsten, molybdenum and niobium and the aforementioned metal element having a catalytic function in electroless plating.