The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2013
Filed:
Jul. 18, 2008
Atsushi Yabe, Kitaibaraki, JP;
Junichi Ito, Kitaibaraki, JP;
Yoshiyuki Hisumi, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Junichi Ito, Kitaibaraki, JP;
Yoshiyuki Hisumi, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Nippon Mining & Metals Co., Ltd., Tokyo, JP;
Abstract
A plated article has an alloy thin film formed on a substrate and having a catalytically active metal (A) for electroless plating and a metal (B) capable of undergoing displacement plating with a metal ion contained in an electroless plating solution, and a metal thin film formed on the alloy thin film by electroless displacement and reduction plating. The alloy thin film of the catalytically active metal (A) and the metal (B) capable of displacement plating has a composition comprising 5 at % to 40 at % of the metal (A). The metal thin film formed by electroless displacement and reduction plating is a metal thin film having a thickness no greater than 10 nm and a resistivity no greater than 10 μΩ·cm. Preferably, the metal (B) has a barrier function with respect to a metal of the metal thin film.