The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Mar. 31, 2004
Toru Imori, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Yoshihisa Fujihira, Takatsuki, JP;
Toru Imori, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Yoshihisa Fujihira, Takatsuki, JP;
Nippon Mining & Metals Co., Ltd., Minato-ku, Tokyo, JP;
Abstract
A method for metal plating with good adhesion to materials that are difficult to plate wherein a material to be plated is surface-treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, surface treatment is performed with a solution containing a noble metal compound, and electroless plating is performed. Alternatively, a metal plating method is provided wherein a material to be plated is surface-treated with a liquid in which a noble metal compound and a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability have already been mixed or reacted, is heat treated at a high temperature of at least 150° C. in air or an inert gas atmosphere, and electroless plating is performed.