The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2013
Filed:
Jul. 30, 2004
Atsushi Yabe, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Yoshihisa Fujihira, Takatsuki, JP;
Atsushi Yabe, Kitaibaraki, JP;
Junnosuke Sekiguchi, Kitaibaraki, JP;
Toru Imori, Kitaibaraki, JP;
Yoshihisa Fujihira, Takatsuki, JP;
Nippon Mining & Metals Co., Ltd., Tokyo, JP;
Abstract
An electroless copper plating solution that is favorable to improve the adhesion of a plating film and realizes uniform plating at a low temperature is characterized by containing a water-soluble nitrogen-containing polymer in an electroless copper plating solution, and preferably the above-mentioned electroless copper plating solution contains glyoxylic acid and phosphinic acid as reducing agents. The water-soluble nitrogen-containing polymer is preferably a polyacrylamide or a polyethyleneimine and, preferably, its weight average molecular weight (Mw) is at least 100,000 and Mw/Mn is 10.0 or less.