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For the Inventor, By the Inventor

Tokyo, Japan

Napra Co., Ltd.


USPTO Granted Patents = 43

% Expired Patents = 53.5


Forward Citations = 153

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7 inventors (with patents filed for the assignee):

goldMedal Shigenobu Sekine (43 out of 49 patents)

silverMedal Yurina Sekine (26 out of 26 patents)

bronzeMedal Yoshiharu Kuwana (10 out of 10 patents)

4.  Ryuji Kimura (3 out of 3 patents)

5.  Chihiro Shimaya (2 out of 2 patents)

6.  Hiroaki Ikeda (2 out of 127 patents)

7.  Kazutoshi Kamibayashi (2 out of 2 patents)


Core Competencies:
Semiconductor Device
Electronic Device
Metal Particle
Bonding Structure
Wiring Substrate
Integrated Circuit
Light-Emitting Device
Conductive Composition
Substrate
Spherical Particles
Nano-Composite Structure
Functional Material

43 patents:

1. 12113321 - Terminal (2024-10-08),
2. 11534870 - Metal particle (2022-12-27),
3. 11453089 - Bonding structure (2022-09-27),
4. 11364575 - Metal particle (2022-06-21),
5. 10906136 - Joint structure (2021-02-02),
6. 10629506 - Preform for semiconductor encapsulation (2020-04-21),
7. 10507551 - Metal particle and articles formed therefrom (2019-12-17),
8. 10478924 - Metal particle and electroconductive paste formed therefrom (2019-11-19),
9. 10468376 - Semiconductor device and method for manufacturing the same (2019-11-05),
10. 10016848 - Metal particles having intermetallic compound nano-composite structure crystal (2018-07-10),
11. 9950925 - Method for forming functional part in minute space (2018-04-24),
12. 9950496 - Multi-layer preform sheet (2018-04-24),
13. 9924592 - Three-dimensional laminated circuit board, electronic device, information processing system, and information network system (2018-03-20),
14. 9735074 - Semiconductor device (2017-08-15),
15. 9730325 - Substrate with built-in passive element (2017-08-08),
Company Overview
Napra Co., Ltd., based in Tokyo, specializes in advanced semiconductor technologies and electronic devices. The company focuses on the development and manufacturing of innovative materials, including metal particles and functional materials, which are essential for modern wiring substrates and integrated circuit devices. With a commitment to enhancing light-emitting diode technologies and bonding structures, Napra plays a significant role in the evolution of electronic components, contributing to various applications in the semiconductor industry.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

43 Patents

#880 in Tokyo

#1,886 in Japan

#16,047 in the World

Tokyo, JP
Tokyo, Japan

Napra Co., Ltd.

Forward Citations = 153

7 inventors:

goldMedal Shigenobu Sekine (43 out of 49 patents)

silverMedal Yurina Sekine (26 out of 26 patents)

bronzeMedal Yoshiharu Kuwana (10 out of 10 patents)

4.  Ryuji Kimura (3 out of 3 patents)

5.  Chihiro Shimaya (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Napra Co., Ltd.. Retrieved from https://idiyas.com/company/napra-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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