The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Aug. 18, 2016
Applicant:

Napra Co., Ltd., Katsushika-ku, Tokyo, JP;

Inventors:

Shigenobu Sekine, Tokyo, JP;

Hiroaki Ikeda, Tokyo, JP;

Assignee:

Napra Co., Ltd., Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0275 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/573 (2013.01); H01L 27/0688 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01);
Abstract

Aiming at providing a three-dimensional laminated circuit board which can be confirmed, in an easy and exact manner, to be an authentic product having been manufactured and packaged honestly; and at providing an electronic device, an information processing system, and an information network system using the same, disclosed is a three-dimensional laminated circuit board that includes a substrate, interconnects, and an authentication pattern; the interconnects being provided in the thickness direction of the substrate; wherein the authentication pattern is provided on the substrate, and is characterized by material, shape, layout, structure or size discriminable from those of the interconnects and the substrate.


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