The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Nov. 03, 2016
Applicant:
Napra Co., Ltd., Katsushika-Ku, Tokyo, JP;
Inventors:
Shigenobu Sekine, Tokyo, JP;
Chihiro Shimaya, Tokyo, JP;
Assignee:
Napra Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B32B 15/01 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
B32B 15/01 (2013.01); H01B 1/026 (2013.01); Y10T 428/12181 (2015.01); Y10T 428/12715 (2015.01);
Abstract
A multi-layer preform sheet having at least a first layer and a second layer, the first layer being composed of a solder material that contains an intermetallic compound, and the second layer containing a first metal having a melting point of 300° C. or above, and a second metal capable of forming an intermetallic compound with the first metal.