The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Oct. 26, 2016
Applicant:
Napra Co., Ltd., Katsushika-ku, Tokyo, JP;
Inventor:
Shigenobu Sekine, Tokyo, JP;
Assignee:
Napra Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B23K 35/02 (2006.01); B22F 1/00 (2006.01); C22C 13/00 (2006.01); H01L 23/00 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 9/02 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B22F 1/0048 (2013.01); B22F 1/025 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 9/02 (2013.01); C22C 13/00 (2013.01); H01B 1/22 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); B22F 2301/30 (2013.01); B22F 2301/40 (2013.01); B22F 2303/15 (2013.01); B22F 2303/30 (2013.01); B22F 2304/10 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13447 (2013.01); H01L 2924/01327 (2013.01);
Abstract
Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.