The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2021
Filed:
Aug. 28, 2020
Applicant:
Napra Co., Ltd., Tokyo, JP;
Inventor:
Shigenobu Sekine, Tokyo, JP;
Assignee:
Napra Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/26 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 2103/08 (2018.08);
Abstract
Disclosed is a joint structure that includes a basal phase that contains Sn and an Sn—Cu alloy, and an intermetallic compound that is composed of Sn, Cu and Ni, and is contained in the basal phase; the Sn—Cu alloy and the intermetallic compound form an endotaxial joint; area ratio of the endotaxial joint, when assuming the total area of joint face between the Sn—Cu alloy and the intermetallic compound as 100%, is 30% or larger; and the joint structure contains 0.7 to 40% by mass of Cu, 0.1 to 5% by mass of Ni, and the balance of Sn.