The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2019
Filed:
Jun. 05, 2018
Applicant:
Napra Co., Ltd., Katsushika-ku, Tokyo, JP;
Inventor:
Shigenobu Sekine, Tokyo, JP;
Assignee:
Napra Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); B23K 35/02 (2006.01); B22F 1/02 (2006.01); C22C 13/00 (2006.01); H01L 23/00 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 9/02 (2006.01); H01B 1/22 (2006.01); H01B 1/02 (2006.01); H01B 1/04 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B22F 1/0048 (2013.01); B22F 1/025 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 9/02 (2013.01); C22C 13/00 (2013.01); H01B 1/02 (2013.01); H01B 1/026 (2013.01); H01B 1/04 (2013.01); H01B 1/22 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); B22F 2301/30 (2013.01); B22F 2301/40 (2013.01); B22F 2303/15 (2013.01); B22F 2303/30 (2013.01); B22F 2304/10 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13311 (2013.01); H01L 2224/13411 (2013.01); H01L 2224/13447 (2013.01); H01L 2924/01327 (2013.01);
Abstract
An electro-conductive paste includes a metal particle and a vehicle in which the metal particle is dispersed. The metal particle has a particle size in a range from 1 μm to 20 μm and consists of an outer shell and a core part. The core part contains Sn or a Sn alloy. The outer shell contains an intermetallic compound of Sn and Cu and covers 50% or more of a total surface area of the core part.