The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
Jun. 22, 2017
Applicant:
Napra Co., Ltd., Katsushika-Ku, Tokyo, JP;
Inventors:
Shigenobu Sekine, Tokyo, JP;
Chihiro Shimaya, Tokyo, JP;
Assignee:
Napra Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); C22C 13/00 (2006.01); H01L 23/29 (2006.01); C22C 9/00 (2006.01); B32B 15/01 (2006.01); B23K 35/26 (2006.01); H01L 21/56 (2006.01); H01L 23/02 (2006.01); B23K 35/30 (2006.01); C22C 9/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/06 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); B23K 35/30 (2013.01); B23K 35/302 (2013.01); B32B 15/01 (2013.01); C22C 9/00 (2013.01); C22C 9/02 (2013.01); C22C 13/00 (2013.01); H01L 21/56 (2013.01); H01L 23/02 (2013.01); H01L 23/29 (2013.01); H01L 23/3121 (2013.01);
Abstract
Disclosed is a preform for semiconductor encapsulation, mainly containing a metal or alloy, the metal or alloy further containing Sn or Sn alloy, and, Cu or Cu alloy, and still further containing at least 2% by weight of an intermetallic compound of Cu and Sn.
Sekine, Shigenobu. (2020). Preform for semiconductor encapsulation (U.S. Patent No. 10629506). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10629506
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile