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Hsinchu, Taiwan

Kingpak Technology Inc.

USPTO Granted Patents = 81

% Expired Patents = 32.1

EPO Patents = 10

Forward Citations = 421

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90 inventors (with patents filed for the assignee):

Chung-Hsien Hsin (23 out of 23 patents)

Hsiu-Wen Tu (23 out of 23 patents)

Jichen Wu (15 out of 21 patents)

4. Chung Hsien Hsin (14 out of 15 patents)

5. Li-Chun Hung (10 out of 32 patents)

6. Chien-Chen Lee (9 out of 33 patents)

7. Jian-Ru Chen (9 out of 9 patents)

8. Hsiu Wen Tu (9 out of 12 patents)

9. Jo-Wei Yang (8 out of 8 patents)

10. Chun-Hua Chuang (8 out of 8 patents)

11. Ren-Long Kuo (8 out of 8 patents)

12. Young-Houng Shiao (8 out of 8 patents)

13. Chen Pin Peng (7 out of 8 patents)

14. Jackson Hsieh (7 out of 8 patents)

15. Chen-Pin Peng (6 out of 7 patents)

Core Competencies:

Image Sensor

Sensor Package

Chip-Scale Structure

Optical Package

Defect Inspection

Wafer Level Packaging

Integrated Circuit

Stacked Structure

Molding Method

Focal Length

Transparent Layer

Memory Module

81 patents: Sort by Forward Citations

1. 11552120 - Chip-scale sensor package structure (2023-01-10),

2. 11309275 - Sensor package structure (2022-04-19),

3. 11257964 - Sensor package structure (2022-02-22),

4. 11227885 - Image sensor package with particle blocking dam (2022-01-18),

5. 11133348 - Sensor package structure and sensing module thereof (2021-09-28),

6. 11094056 - Defect inspection method for sensor package structure (2021-08-17),

7. 10964615 - Chip-scale sensor package structure (2021-03-30),

8. 10916511 - Method for reducing warpage occurred to substrate strip after molding process (2021-02-09),

9. 10868062 - Sensor package structure (2020-12-15),

10. 10825851 - Sensor package structure (2020-11-03),

11. 10804413 - Package component (2020-10-13),

12. 10727141 - Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus (2020-07-28),

13. 10720370 - Sensor package structure (2020-07-21),

14. 10700111 - Optical sensor (2020-06-30),

15. 10692917 - Sensor package structure (2020-06-23),

Kingpak Technology Inc., based in Hsinchu, Taiwan, specializes in advanced packaging solutions for image sensors. The company focuses on innovative technologies such as chip-scale structures and optical packages, enhancing the performance and reliability of integrated circuits. Kingpak is recognized for its expertise in wafer-level packaging and defect inspection, which are critical for the development of high-quality sensor packages. Their commitment to research and development positions them as a key player in the image sensor packaging industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

81 Patents

#71 in Hsinchu

#278 in Taiwan

#9,347 in the World

Hsinchu, Taiwan

Kingpak Technology Inc.

Forward Citations = 421

90 inventors:

Chung-Hsien Hsin (23 out of 23 patents)

Hsiu-Wen Tu (23 out of 23 patents)

Jichen Wu (15 out of 21 patents)

4. Chung Hsien Hsin (14 out of 15 patents)

5. Li-Chun Hung (10 out of 32 patents)

Please report any incorrect information to [email protected]

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