For the Inventor, By the Inventor

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Hsinchu, Taiwan

Kingpak Technology Inc.

USPTO Granted Patents = 81

% Expired Patents = 32.1

EPO Patents = 10

Forward Citations = 421

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90 inventors (with patents filed for the assignee):

Chung-Hsien Hsin (23 out of 23 patents)

Hsiu-Wen Tu (23 out of 23 patents)

Jichen Wu (15 out of 21 patents)

4. Chung Hsien Hsin (14 out of 15 patents)

5. Li-Chun Hung (10 out of 32 patents)

6. Chien-Chen Lee (9 out of 33 patents)

7. Jian-Ru Chen (9 out of 9 patents)

8. Hsiu Wen Tu (9 out of 12 patents)

9. Jo-Wei Yang (8 out of 8 patents)

10. Chun-Hua Chuang (8 out of 8 patents)

11. Ren-Long Kuo (8 out of 8 patents)

12. Young-Houng Shiao (8 out of 8 patents)

13. Chen Pin Peng (7 out of 8 patents)

14. Jackson Hsieh (7 out of 8 patents)

15. Chen-Pin Peng (6 out of 7 patents)

Core Competencies:

Image Sensor

Sensor Package

Chip-Scale Structure

Optical Package

Defect Inspection

Wafer Level Packaging

Integrated Circuit

Stacked Structure

Molding Method

Focal Length

Transparent Layer

Memory Module

81 patents: Sort by Forward Citations

1. 11552120 - Chip-scale sensor package structure (2023-01-10),

2. 11309275 - Sensor package structure (2022-04-19),

3. 11257964 - Sensor package structure (2022-02-22),

4. 11227885 - Image sensor package with particle blocking dam (2022-01-18),

5. 11133348 - Sensor package structure and sensing module thereof (2021-09-28),

6. 11094056 - Defect inspection method for sensor package structure (2021-08-17),

7. 10964615 - Chip-scale sensor package structure (2021-03-30),

8. 10916511 - Method for reducing warpage occurred to substrate strip after molding process (2021-02-09),

9. 10868062 - Sensor package structure (2020-12-15),

10. 10825851 - Sensor package structure (2020-11-03),

11. 10804413 - Package component (2020-10-13),

12. 10727141 - Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus (2020-07-28),

13. 10720370 - Sensor package structure (2020-07-21),

14. 10700111 - Optical sensor (2020-06-30),

15. 10692917 - Sensor package structure (2020-06-23),

KINGPAK TECHNOLOGY INC. is a leading technology company specializing in the design and manufacturing of high-quality electronic components. With decades of experience, we offer innovative solutions for various industries, including telecommunications, automotive, consumer electronics, and more. Our commitment to excellence, customer satisfaction, and continuous improvement sets us apart as a trusted partner in the industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 15 2026

81 Patents

#71 in Hsinchu

#278 in Taiwan

#9,329 in the World

Hsinchu, Taiwan

Kingpak Technology Inc.

Forward Citations = 421

90 inventors:

Chung-Hsien Hsin (23 out of 23 patents)

Hsiu-Wen Tu (23 out of 23 patents)

Jichen Wu (15 out of 21 patents)

4. Chung Hsien Hsin (14 out of 15 patents)

5. Li-Chun Hung (10 out of 32 patents)

Please report any incorrect information to [email protected]

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