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For the Inventor, By the Inventor

Hsin-Chu County, Taiwan

Kingpak Technology Inc.


USPTO Granted Patents = 81


Trademarks = 1

Forward Citations = 409

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91 inventors (with patents filed for the assignee):

goldMedal Chung-Hsien Hsin (23 out of 23 patents)

silverMedal Hsiu-Wen Tu (23 out of 23 patents)

bronzeMedal Jichen Wu (15 out of 21 patents)

4.  Chung Hsien Hsin (14 out of 15 patents)

5.  Li-Chun Hung (10 out of 24 patents)

6.  Chien-Chen Lee (9 out of 29 patents)

7.  Jian-Ru Chen (9 out of 9 patents)

8.  Hsiu Wen Tu (9 out of 12 patents)

9.  Jo-Wei Yang (8 out of 8 patents)

10.  Chun-Hua Chuang (8 out of 8 patents)

11.  Ren-Long Kuo (8 out of 8 patents)

12.  Young-Houng Shiao (8 out of 8 patents)

13.  Chen Pin Peng (7 out of 8 patents)

14.  Jackson Hsieh (7 out of 8 patents)

15.  Chen-Pin Peng (6 out of 7 patents)


Core Competencies:
Chip-Scale Sensor Package
Image Sensor Packaging
Optical Sensor
Defect Inspection
Wafer Level Image Sensor
High Resolution Camera Module
Molded Image Sensor
Substrate Structure
Integrated Lens Module
Sensor Package Structure
Two-Stage Packaging Method
Passive Component Integration

81 patents:

1. 11552120 - Chip-scale sensor package structure (2023-01-10),
2. 11309275 - Sensor package structure (2022-04-19),
3. 11257964 - Sensor package structure (2022-02-22),
4. 11227885 - Image sensor package with particle blocking dam (2022-01-18),
5. 11133348 - Sensor package structure and sensing module thereof (2021-09-28),
6. 11094056 - Defect inspection method for sensor package structure (2021-08-17),
7. 10964615 - Chip-scale sensor package structure (2021-03-30),
8. 10916511 - Method for reducing warpage occurred to substrate strip after molding process (2021-02-09),
9. 10868062 - Sensor package structure (2020-12-15),
10. 10825851 - Sensor package structure (2020-11-03),
11. 10804413 - Package component (2020-10-13),
12. 10727141 - Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus (2020-07-28),
13. 10720370 - Sensor package structure (2020-07-21),
14. 10700111 - Optical sensor (2020-06-30),
15. 10692917 - Sensor package structure (2020-06-23),
KINGPAK TECHNOLOGY INC. is a leading technology company specializing in the design and manufacturing of high-quality electronic components. With decades of experience, we offer innovative solutions for various industries, including telecommunications, automotive, consumer electronics, and more. Our commitment to excellence, customer satisfaction, and continuous improvement sets us apart as a trusted partner in the industry.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

81 Patents

#1 in Hsin-Chu County

#268 in Taiwan

#8,983 in the World

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Hsin-Chu County, Taiwan

Kingpak Technology Inc.

Forward Citations = 409

91 inventors:

goldMedal Chung-Hsien Hsin (23 out of 23 patents)

silverMedal Hsiu-Wen Tu (23 out of 23 patents)

bronzeMedal Jichen Wu (15 out of 21 patents)

4.  Chung Hsien Hsin (14 out of 15 patents)

5.  Li-Chun Hung (10 out of 24 patents)

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