The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Oct. 29, 2018
Kingpak Technology Inc., Hsin-Chu County, TW;
Jian-Ru Chen, Hsin-Chu County, TW;
Jo-Wei Yang, Hsin-Chu County, TW;
Chung-Hsien Hsin, Hsin-Chu County, TW;
Hsiu-Wen Tu, Hsin-Chu County, TW;
KINGPAK TECHNOLOGY INC., Hsin-Chu County, TW;
Abstract
A sensor package structure includes a substrate, an electronic chip fixed on the substrate by flip-chip bonding, a sealant disposed on the substrate and embedding the electronic chip therein, a sensor chip with a size larger than that of the electronic chip, a light-permeable sheet, a plurality of metal wires electrically connected to the substrate and the sensor chip, and a package body. A bottom surface of the sensor chip is disposed on the sealant to be spaced apart from the electronic chip. A lateral surface of the sensor chip is horizontally spaced apart from that of the sealant by a distance less than or equal to 3 mm. The package body is disposed on the substrate and covers the metal wires as well as the lateral sides of the sealant and the sensor chip. The light-permeable sheet is fixed above the sensor chip through the package body.