Location History:
- Hsin-Chu Hsien, TW (2014 - 2015)
- Hsin-Chu County, TW (2018 - 2020)
Company Filing History:
Years Active: 2014-2020
Title: Jo-Wei Yang: Innovator in Sensor Package Structures
Introduction
Jo-Wei Yang is a prominent inventor based in Hsin-Chu County, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of eight patents. His innovative designs focus on enhancing the functionality and efficiency of sensor package structures.
Latest Patents
Among his latest patents, Jo-Wei Yang has developed a sensor package structure that includes a substrate, a sensor chip, and a glass cover. This design features a substrate made of a material with a coefficient of thermal expansion (CTE) less than 10 ppm/°C. The glass cover is designed to enclose the sensor chip and metal wires, creating an accommodating space that optimizes sensor performance. Another notable patent involves a sensor package structure that incorporates an electronic chip fixed by flip-chip bonding, a sealant, and a light-permeable sheet. This innovative design ensures that the sensor chip is effectively spaced from the electronic chip, enhancing the overall functionality of the package.
Career Highlights
Jo-Wei Yang is currently employed at Kingpak Technology Inc., where he continues to push the boundaries of sensor technology. His work has been instrumental in developing advanced sensor package structures that meet the demands of modern applications.
Collaborations
Throughout his career, Jo-Wei Yang has collaborated with talented individuals such as Hsiu-Wen Tu and Jian-Ru Chen. These partnerships have contributed to the successful development of his innovative patents.
Conclusion
Jo-Wei Yang is a distinguished inventor whose work in sensor package structures has made a significant impact in the field. His innovative designs and collaborations continue to drive advancements in sensor technology.