The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2015
Filed:
Feb. 13, 2013
Kingpak Technology Inc., Chu-Pei, Hsin-Chu Hsien, TW;
Chun-Hua Chuang, Hsin-Chu Hsien, TW;
Chien-Wei Chang, Hsin-Chu Hsien, TW;
Chen-Pin Peng, Hsin-Chu Hsien, TW;
Chung-Hsien Hsin, Hsin-Chu Hsien, TW;
Chun-Lung Huang, Hsin-Chu Hsien, TW;
Hsiu-Wen Tu, Hsin-Chu Hsien, TW;
Cheng-Chang Wu, Hsin-Chu Hsien, TW;
Chung-Yu Yang, Hsin-Chu Hsien, TW;
Rong-Chang Wang, Hsin-Chu Hsien, TW;
Jo-Wei Yang, Hsin-Chu Hsien, TW;
Kingpak Technology Inc., Hsin-chu Hsien, TW;
Abstract
A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.