This inventor holds 8 USPTO granted patents and 3 EPO patents. Top assignee: Kingpak Technology Inc.. Active years: 2009-2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hukou Township, Hsinchu County, TW (2009 - 2011)
- Hsin-Chu Hsien, TW (2013 - 2015)
- Hsin-Chu County, TW (2019)
Company Filing History:
Years Active: 2009-2019
Title: Innovations by Chun-Hua Chuang
Introduction
Chun-Hua Chuang is a notable inventor based in Hsin-Chu Hsien, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of 8 patents. His work focuses on enhancing the functionality and efficiency of sensor packages and image sensors.
Latest Patents
One of his latest patents is a sensor package structure that includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate features a chip bonding region and several first pads outside this region. The sensor chip is placed on the chip bonding region and contains a sensing region along with multiple second pads. Each wire connects one of the first pads to one of the second pads. The supporting frame is positioned above the substrate and/or the sensor chip, incorporating a positioning portion. The transparent cover is secured above the sensor chip by this positioning portion, maintaining a vertical distance between them. The molding compound fills the space between the substrate and the supporting frame, covering part of the upper surface of the supporting frame.
Another significant patent is a method for reducing tilt of the optical unit during the manufacture of an image sensor. This method involves several steps, including providing a semimanufacture of the image sensor, conducting a preheating process, applying adhesive, mounting the optical unit, and packaging. The preheating process ensures a stabilized environment during the adhesive application and optical unit mounting, which helps maintain the optical unit's flatness once attached. This method effectively reduces the chances of tilt and cracking, contributing to a higher yield rate.
Career Highlights
Chun-Hua Chuang is currently employed at Kingpak Technology Inc., where he continues to innovate in the field of sensor technology. His expertise and inventions have significantly impacted the industry, enhancing the performance and reliability of various sensor applications.
Collaborations
Chun-Hua has collaborated with several talented individuals, including Chung-Hsien Hsin and Hsiu-Wen Tu. Their teamwork has fostered a creative environment that promotes innovation and the development of cutting-edge technologies.
Conclusion
Chun-Hua Chuang's contributions to sensor technology through his patents and collaborative efforts highlight his role as a leading inventor in the field. His work continues to influence advancements in sensor applications, ensuring higher efficiency and reliability
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile