The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2011

Filed:

May. 16, 2008
Applicants:

Chung-hsien Hsin, Hsinchu, TW;

Chun-hua Chuang, Hukou Township, Hsinchu County, TW;

Chen-pin Peng, Beipu Township, Hsinchu County, TW;

Chien-wei Chang, Sinpu Township, Hsinchu County, TW;

Chien-hen Lin, Yangmei Township, Taoyuan County, TW;

Inventors:

Chung-Hsien Hsin, Hsinchu, TW;

Chun-Hua Chuang, Hukou Township, Hsinchu County, TW;

Chen-pin Peng, Beipu Township, Hsinchu County, TW;

Chien-Wei Chang, Sinpu Township, Hsinchu County, TW;

Chien-Hen Lin, Yangmei Township, Taoyuan County, TW;

Assignee:

Kingpak Technology Inc., Hsin Chu Hsien, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
Abstract

An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced.


Find Patent Forward Citations

Hsin, Chung-Hsien. (2011). Image sensor structure and integrated lens module thereof (U.S. Patent No. 8004602). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8004602

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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