The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 10, 2019
Filed:
Feb. 28, 2018
Kingpak Technology Inc., Hsin-Chu County, TW;
Chun-Hua Chuang, Hsin-Chu County, TW;
Wen-Chung Huang, Hsin-Chu County, TW;
Chung-Hsien Hsin, Hsin-Chu County, TW;
Chen-Pin Peng, Hsin-Chu County, TW;
Li-Chun Hung, Hsin-Chu County, TW;
KINGPAK TECHNOLOGY INC., Hsin-Chu County, TW;
Abstract
A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.