Hsin-Chu County, Taiwan

Li-Chun Hung

USPTO Granted Patents = 24 


Average Co-Inventor Count = 3.5

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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24 patents (USPTO):Explore Patents

Title: Innovations by Li-Chun Hung: A Leader in Sensor Package Structures

Introduction

Li-Chun Hung, based in Hsin-Chu County, Taiwan, has made significant contributions to technology with a portfolio of 21 patents. His innovative work focuses on sensor package structures, highlighting his expertise in electronic packaging and semiconductor technologies.

Latest Patents

Among his latest patents, Li-Chun Hung has developed advanced sensor package structures that enhance the functionality and efficiency of electronic devices. One notable patent describes a sensor package structure that includes a substrate, a sensor chip, and a unique ring-shaped solder mask frame. This design features a light permeable member that, together with the ring-shaped support, defines an enclosed space, ensuring optimal performance of the sensor chip.

Another noteworthy patent outlines a sensor package structure incorporating a ring-shaped wall and a light-permeable layer. This innovative design allows for efficient electrical coupling between the sensor chip and the substrate, while the embedded protrusions of the substrate strengthen the overall integrity of the package.

Career Highlights

Li-Chun Hung has built a distinguished career with significant roles at renowned companies such as Tong Hsing Electronic Industries, Ltd. and Kingpak Technology Inc. His work at these firms has propelled the advancement of sensor technologies, showcasing his ability to bridge theoretical concepts with practical applications.

Collaborations

Throughout his career, Li-Chun has collaborated with talented professionals, including Chien-Chen Lee and Ya-Han Chang. These collaborations have fostered a creative environment that emphasizes innovation and the exchange of ideas, helping to produce groundbreaking advancements in sensor technology.

Conclusion

Li-Chun Hung's contributions to the field of sensor package structures underscore his status as a leading inventor in the technology industry. His 21 patents reflect a commitment to innovation and the pursuit of excellence, making him a valuable asset in the realms of electronics and semiconductors. As technology continues to evolve, Li-Chun's work will likely play a critical role in shaping the future of smart devices and sensor applications.

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