The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2025
Filed:
Feb. 24, 2023
Tong Hsing Electronic Industries, Ltd., Taipei, TW;
Chien-Chen Lee, Hsin-Chu County, TW;
Li-Chun Hung, Hsin-Chu County, TW;
Chia-Shuai Chang, Hsin-Chu County, TW;
TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei, TW;
Abstract
A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, a supporting layer having a ring-shape and being sandwiched between the sensor chip and the light-permeable layer, and an encapsulant that is formed on the substrate. The supporting layer has an inner roughened surface being ring-shaped and having an irregular pattern. The light-permeable layer, the inner roughened surface of the supporting layer, and the sensor chip jointly define an enclosed space. The sensor chip, the supporting layer, and the light-permeable layer are embedded in the encapsulant, and at least part of outer surface of the light-permeable layer is exposed from the encapsulant. The inner roughened surface is configured to scatter light passing through the light-permeable layer to arrive thereon.