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Tong Hsing Electronic Industries, Ltd.

USPTO Granted Patents = 66

% Expired Patents = 9.1

EPO Patents = 1

Trademarks = 3

Forward Citations = 16

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82 inventors (with patents filed for the assignee):

Chien-Chen Lee (24 out of 33 patents)

Li-Chun Hung (22 out of 32 patents)

Jui-Hung Hsu (11 out of 11 patents)

4. Chia-shuai Chang (10 out of 10 patents)

5. Chia-Shuai Chang (9 out of 9 patents)

6. Ya-Han Chang (8 out of 11 patents)

7. Jian-Yu Shih (5 out of 5 patents)

8. Jhih-Wei Lai (5 out of 5 patents)

9. Shih-Han Wu (5 out of 5 patents)

10. Wen-Chung Chiang (4 out of 5 patents)

11. Ming-Yen Pan (4 out of 4 patents)

12. Fu-Chou Liu (3 out of 12 patents)

13. Chien-Cheng Wei (3 out of 3 patents)

14. Keng-Chung Wu (3 out of 4 patents)

15. Ying-Chi Hsieh (3 out of 4 patents)

Core Competencies:

Chip Package Structure

Circuit Board Structure

Sensor Package Structure

Optical Package Structure

Ceramic Substrate

Power Component Submount

Active Metal Brazing

Fingerprint Sensor

Multilayer Circuit Board

Heat-Dissipation Package

Image Sensing Device

Conductive Circuit Board

66 patents: Sort by Forward Citations

1. 12761071 - Sensor package structure and sensing module thereof (2026-10-13),

2. 12747191 - Composite ceramic substrate having multi-layer configuration (2026-09-29),

3. 12746736 - Pre-mold direct bond copper (DBC) substrate and manufacturing method thereof (2026-09-29),

4. 12727506 - Chip package structure and method for producing the same (2026-09-01),

5. 12727505 - Method for reducing warpage occurred to substrate during packaging process (2026-09-01),

6. 12722359 - Active metal brazing substrate and method for manufacturing the same (2026-09-01),

7. 12696772 - Chip package structure (2026-07-28),

8. 12690286 - Chip packaging structure (2026-07-21),

9. 12672232 - Printed circuit board and method for making the same (2026-06-30),

10. 12666542 - Power component submount and manufacturing method thereof (2026-06-23),

11. 12648259 - Optical package structure and optical chip thereof (2026-06-02),

12. 12641731 - Method for manufacturing conductive circuit board (2026-05-26),

13. 12635551 - Chip package structure (2026-05-19),

14. 12635517 - Dual-side heat-dissipation package structure and package structure (2026-05-19),

15. 12622078 - Chip package structure (2026-05-05),

Company Overview

Tong Hsing Electronic Industries, Ltd. is a prominent player in the field of chip packaging technology, headquartered in Taipei, Taiwan. The company specializes in the development and manufacturing of advanced packaging solutions, including chip package structures, circuit board structures, and various sensor package types. Its expertise extends to optical package structures and ceramic substrates, catering to the needs of modern electronics. Tong Hsing is recognized for its innovative approaches, such as active metal brazing and power component submounts, enhancing the performance and reliability of electronic devices.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

66 Patents

#56 in Taipei

#324 in Taiwan

#11,177 in the World

Tong Hsing Electronic Industries, Ltd.

Forward Citations = 16

82 inventors:

Chien-Chen Lee (24 out of 33 patents)

Li-Chun Hung (22 out of 32 patents)

Jui-Hung Hsu (11 out of 11 patents)

4. Chia-shuai Chang (10 out of 10 patents)

5. Chia-Shuai Chang (9 out of 9 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tong Hsing Electronic Industries, Ltd.. Retrieved from https://idiyas.com/company/tong-hsing-electronic-industries

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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