This inventor holds 12 USPTO granted patents and 3 published patent applications. Top assignees: Nustorage Technology Co., Ltd., Kingpak Technology Inc., Tong Hsing Electronic Industries, Ltd.. Active years: 2019-2025.
Company Filing History:
6 out of 6 
3 out of 81 
3 out of 65 Years Active: 2019-2025
Title: Fu-Chou Liu: Innovator in Sensor Package Structures
Introduction
Fu-Chou Liu is a prominent inventor based in Hsin-Chu County, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of 12 patents. His innovative designs focus on enhancing the functionality and efficiency of sensor package structures.
Latest Patents
Among his latest patents, Fu-Chou Liu has developed a sensor package structure having a solder mask frame. This design includes a substrate, a sensor chip, and a ring-shaped solder mask frame that are all integrated on the substrate. The structure features a ring-shaped support positioned on the top side of the solder mask frame, along with a light permeable member. The sensor chip is electrically connected to the substrate, and its sensing region is strategically spaced from the outer lateral side of the chip. This innovative design ensures that the ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip, creating an enclosed space with the light permeable member and the ring-shaped support.
Another notable patent by Liu is a sensor package structure featuring a ring-shaped solder mask frame. Similar to his previous design, this structure also includes a substrate, a sensor chip, and a ring-shaped solder mask frame. The integration of these components allows for enhanced performance and reliability in sensor applications.
Career Highlights
Fu-Chou Liu has worked with several notable companies throughout his career, including Nustorage Technology Co., Ltd. and Tong Hsing Electronic Industries, Ltd. His experience in these organizations has contributed to his expertise in sensor technology and innovation.
Collaborations
Throughout his career, Liu has collaborated with talented individuals such as Chien-Chen Lee and Ya-Han Chang. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the field of sensors.
Conclusion
Fu-Chou Liu's contributions to sensor package structures demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of sensor design, making him a key figure in the advancement of this field.