Shih-Han Wu

Title: Shih-Han Wu: Innovator in Chip Packaging and Circuit Board Technology

Introduction

Shih-Han Wu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic packaging and circuit board technology. With a total of 5 patents, his work focuses on innovative solutions that enhance the performance and reliability of electronic devices.

Latest Patents

Shih-Han Wu's latest patents include a chip package structure and a method for fabricating the same. This invention provides a chip packaging structure that consists of a conductive substrate, a dam, and a metal shielding layer. The conductive substrate features a substrate with vias and electrodes, designed to facilitate efficient chip arrangement and functionality. His second patent relates to a circuit board structure with an embedded ceramic substrate. This design incorporates an insulating base, copper foils, and a ceramic substrate, aimed at improving the overall performance of circuit boards.

Career Highlights

Shih-Han Wu is currently employed at Tong Hsing Electronic Industries, Ltd. His work at this company has allowed him to collaborate on various innovative projects that push the boundaries of electronic packaging technology. His contributions have been instrumental in advancing the capabilities of modern electronic devices.

Collaborations

Shih-Han Wu has worked alongside talented colleagues, including Jhih-Wei Lai and Jian-Yu Shih. Their collaborative efforts have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the electronics field.

Conclusion

Shih-Han Wu's contributions to chip packaging and circuit board technology highlight his role as a key innovator in the electronics industry. His patents reflect a commitment to enhancing electronic device performance and reliability.