The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2026

Filed:

Nov. 29, 2023
Applicant:

Tong Hsing Electronic Industries, Ltd., Taipei City, TW;

Inventors:

Yu-Hsien Liao, Taipei City, TW;

Shih-Han Wu, Taipei City, TW;

Jhih-Wei Lai, Taipei City, TW;

Jian-Yu Shih, Taipei City, TW;

Ming-Yen Pan, Taipei City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/12 (2013.01); H05K 1/18 (2013.01); H05K 2201/10984 (2013.01);
Abstract

A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.


Find Patent Forward Citations

Liao, Yu-Hsien. (2026). Circuit board structure and method for manufacturing the same (U.S. Patent No. 12604415). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12604415

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…