The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Jan. 05, 2024
Tong Hsing Electronic Industries, Ltd., Taipei City, TW;
Yu-Hsiang Liu, Taipei City, TW;
Li-Chun Hung, Taipei City, TW;
TONG HSING ELECTRONIC INDUSTRIES, LTD., Taipei City, TW;
Abstract
A method for reducing warpage occurred to a substrate during a packaging process includes attaching a plurality of dies to an upper surface of the substrate; attaching an adhesive material having a first curing temperature to a lower surface of the substrate; applying a liquid-packaging material having a second curing temperature to surroundings of the dies; heating the substrate, the adhesive material, and the liquid-packaging material to a heating temperature not less than the first curing temperature and the second curing temperature; and cooling the substrate, the adhesive material, and the liquid-packaging material to a room temperature. When being cooled to the room temperature, the liquid-packaging material applies an upper-surface shrinkage stress to the upper surface of the substrate, the adhesive material applies a lower-surface shrinkage stress to the lower surface of the substrate, and the lower-surface shrinkage stress is substantially equal to the upper-surface shrinkage stress.