This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Yu-hsiang Liu in Sensor Technology
Introduction
Yu-hsiang Liu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of sensor technology. His innovative work has led to the development of a unique sensor package structure that enhances the functionality and efficiency of sensing devices.
Latest Patents
Yu-hsiang Liu holds a patent for a "Sensor package structure and manufacturing method thereof." This invention includes a substrate, a first solder mask layer, a convex structure, a sensing chip, and an engaging layer. The design ensures that the convex structure and the sensing chip do not come into contact with each other, thereby improving the reliability of the sensor package. This patent showcases his expertise in creating advanced sensor technologies.
Career Highlights
Yu-hsiang Liu is currently employed at Tong Hsing Electronic Industries, Ltd., where he continues to innovate in the field of electronics. His work at the company has allowed him to collaborate with other talented professionals, including his coworker Li-Chun Hung. Together, they strive to push the boundaries of sensor technology.
Collaborations
Due to space constraints, the details of collaborations will not be included.
Conclusion
Yu-hsiang Liu's contributions to sensor technology through his innovative patent demonstrate his commitment to advancing the field. His work at Tong Hsing Electronic Industries, Ltd. continues to influence the development of efficient and reliable sensing devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile