The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Mar. 08, 2022
Applicant:

Kingpak Technology Inc., Hsin-Chu County, TW;

Inventors:

Chia-Shuai Chang, Hsin-Chu County, TW;

Chien-Chen Lee, Hsin-Chu County, TW;

Li-Chun Hung, Hsin-Chu County, TW;

Chien-Yuan Wang, Hsin-Chu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 7/02 (2021.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
G02B 7/021 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H05K 1/181 (2013.01);
Abstract

A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.


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