Hsinchu, Taiwan

Chien-yuan Wang

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-yuan Wang. Retrieved from https://idiyas.com/inventor/chien-yuan-wang-r8sinmpj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.8

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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3 patents (USPTO):Explore Patents

Title: Chien-yuan Wang: Innovator in Sensor Package Structures

Introduction

Chien-yuan Wang is a notable inventor based in Hsin-Chu County, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of 3 patents. His work focuses on innovative sensor package structures that enhance the functionality and efficiency of electronic devices.

Latest Patents

Wang's latest patents include advanced sensor package structures. One of his inventions features a substrate with a sensor chip, a light-curing layer, and a light-permeable layer. This design incorporates a ring-shaped shielding layer that surrounds the sensing region of the sensor chip, optimizing its performance. Another patent presents a similar sensor package structure, which includes a ring-shaped wall and a light-permeable layer, creating an enclosed space that enhances the sensor's capabilities.

Career Highlights

Chien-yuan Wang is currently employed at Tong Hsing Electronic Industries, Ltd., where he continues to develop innovative technologies. His expertise in sensor package structures has positioned him as a key player in the electronics industry.

Collaborations

Wang collaborates with talented coworkers, including Chien-Chen Lee and Li-Chun Hung. Their combined efforts contribute to the advancement of sensor technology and the development of new products.

Conclusion

Chien-yuan Wang's contributions to sensor package structures demonstrate his commitment to innovation in the electronics field. His patents reflect a deep understanding of technology and a drive to improve electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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