The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2025

Filed:

Feb. 08, 2023
Applicant:

Tong Hsing Electronic Industries, Ltd., Taipei, TW;

Inventors:

Chia-Shuai Chang, Hsin-Chu County, TW;

Chien-Chen Lee, Hsin-Chu County, TW;

Li-Chun Hung, Hsin-Chu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/02 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
G02B 5/0278 (2013.01); G02B 5/0221 (2013.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
Abstract

A sensor lens assembly includes a circuit board, an optical module assembled onto the circuit board, and a sensing module that is surrounded by the optical module. The sensing module includes a sensor chip disposed on and electrically coupled to the circuit board, a supporting layer having a ring shape and disposed on the sensor chip, and a light-permeable layer. The light-permeable layer is disposed on the supporting layer through a ring-shaped segment thereof, so that the light-permeable layer, the supporting layer, and the sensor chip jointly define an enclosed space. The ring-shaped segment has a ring-shaped roughened region. A projection space defined by orthogonally projecting the ring-shaped roughened region toward the sensor chip is located outside of a sensing region of the sensor chip and overlaps an entirety of the supporting layer and a part of the enclosed space.


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