Chen-Pin Peng

Title: Chen-Pin Peng: Innovator in Sensor Package Structures

Introduction

Chen-Pin Peng is a notable inventor based in Hsin-Chu County, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of seven patents. His work focuses on innovative sensor package structures that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest patents, Chen-Pin Peng has developed a sensor package structure that includes a substrate, a sensor chip, and a variety of electrical connection members. This structure is designed to improve the connection between the sensor chip and the substrate, utilizing a supporting adhesive layer and a light-permeable sheet. Another notable patent is the sensor package structure and sensing module, which features a light-curing layer and a shielding layer to enhance the performance of the sensor chip. These innovations reflect his commitment to advancing sensor technology.

Career Highlights

Chen-Pin Peng has worked with prominent companies in the electronics industry, including Kingpak Technology Inc. and Tong Hsing Electronic Industries, Ltd. His experience in these organizations has allowed him to collaborate on various projects that push the boundaries of sensor technology.

Collaborations

Throughout his career, Chen-Pin Peng has collaborated with talented individuals such as Chien-Chen Lee and Chun-Hua Chuang. These partnerships have contributed to the development of innovative solutions in the field of sensor packaging.

Conclusion

Chen-Pin Peng is a distinguished inventor whose work in sensor package structures has made a significant impact on the electronics industry. His patents and collaborations demonstrate his dedication to innovation and excellence in technology.