The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Jul. 11, 2019
Kingpak Technology Inc., Hsin-Chu County, TW;
Chien-Chen Lee, Hsin-Chu County, TW;
Chen-Pin Peng, Hsin-Chu County, TW;
Chien-Heng Lin, Hsin-Chu County, TW;
Jian-Ru Chen, Hsin-Chu County, TW;
KINGPAK TECHNOLOGY INC., Hsin-Chu County, TW;
Abstract
A sensor package structure includes a substrate, a sensor chip on the substrate, a ring-shaped support, a light permeable board on the ring-shaped support, and an opaque package body formed on the substrate. A top surface of the sensor chip includes a spacing region and a carrying region surrounding the spacing region. The support is disposed on the carrying region. The light permeable board has a ring-shaped notch recessed from an upper surface thereof, and the notch includes a platform surface at least partially located above the support and a wall surface connected to the platform surface and located above the spacing region. A portion of the opaque package body fills the notch and is defined as a light shielding portion. An inner lateral side of the support is arranged in a projection area formed by orthogonally projecting the platform surface onto the top surface.