This inventor holds 2 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignee: Kingpak Technology Inc.. Active years: 2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020
Title: Chien-Heng Lin: Innovator in Sensor Package Structures
Introduction
Chien-Heng Lin is a prominent inventor based in Hsin-Chu County, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of 2 patents. His work focuses on innovative sensor package structures that enhance the reliability and functionality of electronic devices.
Latest Patents
Chien-Heng Lin's latest patents include a unique sensor package structure. This structure features a substrate with a sensor chip, a ring-shaped support, and a light permeable board. The design incorporates an opaque package body that enhances the sensor's performance. Another notable patent is the package base core, which includes a substrate and stoppers to prevent compound overflow, thereby increasing the reliability of the package.
Career Highlights
Chien-Heng Lin is currently employed at Kingpak Technology Inc., where he continues to innovate in the field of sensor technology. His work has been instrumental in developing advanced packaging solutions that meet the demands of modern electronics.
Collaborations
Chien-Heng Lin collaborates with talented coworkers, including Chen-Pin Peng and Chien-Chen Lee. Their combined expertise contributes to the success of their projects and the advancement of sensor technology.
Conclusion
Chien-Heng Lin is a dedicated inventor whose work in sensor package structures has made a significant impact in the field. His innovative designs and collaborations continue to push the boundaries of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile