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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10600829 B1

PDFFull Text
Date of Patent:
Mar. 24, 2020

Filed:

Jul. 24, 2017

Package base core and sensor package structure

Applicant:

Kingpak Technology Inc., Hsin-Chu County, TW;

Inventors:

Chung-Hsin Hsin, Hsin-Chu County, TW;

Chen-Pin Peng, Hsin-Chu County, TW;

Chien-Heng Lin, Hsin-Chu County, TW;

Kun-Chih Hsieh, Hsin-Chu County, TW;

Assignee:

KINGPAK TECHNOLOGY INC., Hsin-Chu County, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 27/146 (2006.01); H01L 23/04 (2006.01); H01L 23/16 (2006.01); H01L 21/56 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); G01D 11/24 (2006.01); H01L 31/0203 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); G01D 11/245 (2013.01); H01L 21/56 (2013.01); H01L 23/04 (2013.01); H01L 23/16 (2013.01); H01L 23/31 (2013.01); H01L 23/3121 (2013.01); H01L 23/532 (2013.01); H01L 23/564 (2013.01); H01L 24/83 (2013.01); H01L 27/14625 (2013.01); H01L 31/0203 (2013.01); H01L 21/565 (2013.01);
Abstract

The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.

Find Patent Forward Citations

Hsin, Chung-Hsin. (2020). Package base core and sensor package structure (U.S. Patent No. 10600829). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10600829

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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